New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
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31 results for D.L. Rath
Influence of sidewall roughness on the reliability of 0.20-μm Al RIE wiring
- R. Ravikumar
- H. Cichy
- et al.
- 1999
- IITC 1999
Challenges of Aluminum RIE Technology at sub 0.45 μm Pitches
- R. Ravikumar
- R. Filippi
- et al.
- 1999
- IITC 1999
STRUCTURAL CHARACTERISTICS OF CHEMISORBED LEAD ON SINGLE CRYSTAL COPPER SURFACES.
- D.L. Rath
- Dieter M. Kolb
- et al.
- 1983
- ECS Meeting 1983
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Enhancement of Semiconductor Wafer Cleaning by Chelating Agent Addition
- Glenn W. Gale
- David L. Rath
- et al.
- 2001
- JES
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
Study of field-driven wall-configuration conversions for laminated permalloy in the easy-axis state
- D.A. Herman Jr.
- B.E. Argyle
- et al.
- 1988
- Journal of Applied Physics
Edge-curling-wall discontinuities and interactions with bloch walls in easy-axis permalloy
- Dean A. Herman
- Philip L. Trouilloud
- et al.
- 1988
- IEEE Transactions on Magnetics
MECHANISMS OF ELECTROLESS METAL PLATING: I: MIXED POTENTIAL THEORY AND THE INTERDEPENDENCE OF PARTIAL REACTIONS.
- P. Bindra
- David N. Light
- et al.
- 1984
- IBM J. Res. Dev