Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
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10 results for Ted W. Lichoulas
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
Automated Assembly of Duplex Fiber Connectors to Photonic Chips in Standard Microelectronic Tools
- Ted W. Lichoulas
- Eddie L. Kimbrell
- et al.
- 2018
- CLEO 2018
Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- SPIE OPTO 2018
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2016
- OFC 2016
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- GFP 2015
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Automated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology