Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
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16 results for Gerard McVicker
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins
- Mark D. Schultz
- Michael Gaynes
- et al.
- 2018
- ITherm 2018
Eulerian multiphase conjugate model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Mark D. Schultz
- et al.
- 2018
- SEMI-THERM 2018
Microfluidic two-phase cooling of a high power microprocessor part A: Design and fabrication
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2017
- ITherm 2017
Thermal model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- ITherm 2017
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2016
- ITherm 2016
Heat sink induced thermo-mechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2013
- IMAPS 2013