Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
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22 results for Yun-Yu Wang
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Effect of hot carrier stress on device junctions measured by electron holography and scanning capacitance microscopy
- Yun-Yu Wang
- J. Nxumalo
- et al.
- 2018
- Applied Physics Letters
Quantification of local strain distributions in nanoscale strained SiGe FinFET structures
- Shogo Mochizuki
- Conal E. Murray
- et al.
- 2017
- Journal of Applied Physics
High-precision deformation mapping in finFET transistors with two nanometre spatial resolution by precession electron diffraction
- David Cooper
- N. Bernier
- et al.
- 2017
- Applied Physics Letters
Study of phosphorus doped Si:C films formed by in situ doped Si epitaxy and implantation process for n-type metal-oxide-semiconductor devices
- Shogo Mochizuki
- Rainer Loesing
- et al.
- 2017
- JVSTB
Nanoscale strain distributions in embedded SiGe semiconductor devices revealed by precession electron diffraction and dual lens dark field electron holography
- Yun-Yu Wang
- David Cooper
- et al.
- 2015
- Applied Physics Letters
Dual-lens electron holography for junction profiling and strain mapping on semiconductor devices
- Yun-Yu Wang
- Anthony Domenicucci
- et al.
- 2014
- Electronic Device Failure Analysis
Strain mapping of Si devices with stress memorization processing
- Y.Y. Wang
- John Bruley
- et al.
- 2013
- Applied Physics Letters