Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Publications
Date
Featured collections
Popular topics
45 results for Timothy Chainer
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Organic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
Preparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Realization of ultra-low power I/O
- Lei Shan
- Timothy Dickson
- et al.
- 2013
- ECTC 2013
Microprocessor Performance with Multiple Cooling Approaches
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2022
- ITherm 2022
Numerical Investigation of Coolants for Chip-embedded Two-Phase Cooling
- Pritish R. Parida
- Timothy Chainer
- 2021
- SEMI-THERM 2021
Numerical Investigation of Coolants for Chip-embedded Two-Phase Cooling
- Pritish R. Parida
- Timothy Chainer
- 2020
- SEMI-THERM 2020
Sim2Cool: A Two-Phase Cooling System Simulator and Design Tool
- Pritish R. Parida
- Mark D. Schultz
- et al.
- 2018
- ITherm 2018
Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins
- Mark D. Schultz
- Michael Gaynes
- et al.
- 2018
- ITherm 2018