Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
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13 results for Christy Tyberg
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Application of nanoindentation to characterize fracture in ILD films used in the BEOL
- Eva E. Simonyi
- E. Liniger
- et al.
- 2005
- MRS Spring Meeting 2005
Analytical test of 3D integrated circuits
- Raphael P. Robertazzi
- Micheal Scheurman
- et al.
- 2017
- ITC 2017
Thermal analysis of multi-layer functional 3D logic stacks
- Michael Scheuermann
- Shurong Tian
- et al.
- 2016
- 3DIC 2016
3D integration ESD protection design and analysis
- Souvick Mitra
- Ephrem Gebreselasie
- et al.
- 2015
- EOS/ESD 2015
TSV/FET proximity study using dense addressable transistor arrays
- Raphael P. Robertazzi
- Kanak Agarwal
- et al.
- 2015
- IRPS 2015
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- T. Iijima
- Q. Lin
- et al.
- 2006
- IITC 2006
Porous ILD process development for sub 100nm integration
- K. Malone
- S.T. Chen
- et al.
- 2003
- ADMETA 2003
Design and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT