Impurities in the electroplated sub-50 nm cu lines: The effects of the plating additives
- Qiang Huang
- A. Avekians
- et al.
- 2014
- JES
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23 results for Qiang Huang
Electroplating of Fe-rich NiFe alloys in sub-50 nm lines
- D. Liang
- J. Liu
- et al.
- 2014
- JES
An electrochemical method of suppressor screening for Cu plating in sub-100 nm lines
- Qiang Huang
- J. Liu
- et al.
- 2014
- JES
Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
Leveler effect and oscillatory behavior during copper electroplating
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2012
- JES
Electrodeposition of indium on copper for CIS and CIGS solar cell applications
- Q. Huang
- Kathleen B. Reuter
- et al.
- 2011
- JES
Electrodeposited gallium alloy thin films synthesized by solid state reactions for CIGS solar cell
- Shafaat Ahmed
- Kathleen B. Reuter
- et al.
- 2011
- JES
Suppressor effects during copper superfilling of sub-100 nm lines
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2009
- Electrochemical and Solid-State Letters
ALD approach toward electrodeposition of Sb2Te3 for phase-change memory applications
- V. Venkatasamy
- I. Shao
- et al.
- 2008
- JES
Electrodeposition of SbTe phase-change alloys
- Q. Huang
- A.J. Kellock
- et al.
- 2008
- JES