Novel mass reflow method for organic substrates
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2015
- ECTC 2015
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15 results for Sri M. Sri-Jayantha
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Methodology for predicting C4 non-wets during the chip attach process
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2010
- ECTC 2010
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
TrueTrack™ servo technology for high track density storage
- S. Sri-Jayantha
- Hien Dang
- et al.
- 2000
- APMRC 2000
Heat sink induced thermomechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2014
- Journal of Microelectronics and Electronic Packaging
Preface: IEEE Transactions on Magnetics
- Sri Sri-Jayantha
- No Yeol Park
- 2005
- IEEE Transactions on Magnetics
The Role of Static Charge in Ultra-Low Alpha Particle Emissivity Measurements
- Michael. S. Gordon
- Kenneth P. Rodbell
- et al.
- 2015
- IEEE TNS
Impact of organic substrate warp on C4 non-wets
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2011
- IEEE Transactions on CPMT
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- L. Valdevit
- V.D. Khanna
- et al.
- 2008
- Microelectronics Reliability