High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
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108 results for Sebastian Engelmann
A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2017
- OFC 2017
Directed self-assembly patterning strategies for phase change memory applications
- Robert L. Bruce
- Gloria Fraczak
- et al.
- 2017
- SPIE Advanced Lithography 2017
Reducing line edge roughness in si and sin through plasma etch chemistry optimization for photonic waveguide applications
- Nathan Marchack
- Marwan Khater
- et al.
- 2017
- SPIE Advanced Lithography 2017
Ge-on-insulator lateral bipolar transistors
- Jeng-Bang Yau
- Joonah Yoon
- et al.
- 2016
- BCTM 2016
Prospects of high-Ge-content strained SiGe for advanced FinFET generations
- Pouya Hashemi
- Karthik Balakrishnan
- et al.
- 2016
- PRiME/ECS Meeting 2016
Demonstration of record SiGe transconductance and short-channel current drive in High-Ge-Content SiGe PMOS FinFETs with improved junction and scaled EOT
- Pouya Hashemi
- Kam-Leung Lee
- et al.
- 2016
- VLSI Technology 2016
Replacement high-K/metal-gate High-Ge-content strained SiGe FinFETs with high hole mobility and excellent SS and reliability at aggressive EOT ∼7Å and scaled dimensions down to sub-4nm fin widths
- Pouya Hashemi
- Takashi Ando
- et al.
- 2016
- VLSI Technology 2016
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2016
- OFC 2016
Evaluation of ALE processes for patterning
- J. M. Papalia
- Nathan Marchack
- et al.
- 2016
- SPIE Advanced Lithography 2016