Analysis and modeling of dc current crowding for tsv-based 3-d connections and power integrity
- Xin Zhao
- Michael R. Scheuermann
- et al.
- 2014
- IEEE Transactions on CPMT
Publications
Date
Featured collections
Popular topics
38 results for Michael Scheuermann
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
- Xin Zhao
- Yang Wan
- et al.
- 2013
- ICCAD 2013
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
- Xin Zhao
- Michael Scheuermann
- et al.
- 2012
- DAC 2012
A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias
- Matt Wordeman
- Joel Silberman
- et al.
- 2012
- ISSCC 2012
Design and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008
Transmission-line Characterization with Ultrafast Optoeletromes
- G. Arjavalingam
- A. Deutsch
- et al.
- 1993
- IEE/LEOS Summer Topical Meetings 1993
Characterization of Resistive Transmission Lines to 70 GHz with Ultrafast Optoelectronics
- A. Deutsch
- M. Scheuermann
- et al.
- 1993
- IEEE Microwave and Guided Wave Letters
Anomalous Voltage Overshoot During Turn-Off of Thin-Film n-Channel SOI MOSFET's
- E. Dubois
- Ghavam G. Shahidi
- et al.
- 1993
- IEEE Electron Device Letters