Si Incorporation Into AsSeGe Chalcogenides for High Thermal Stability, High Endurance and Extremely Low Vth Drift 3D Stackable Cross-point Memory
- Huai-Yu Cheng
- I. Kuo
- et al.
- 2020
- VLSI Technology 2020
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52 results for Huai-Yu Cheng
A no-verification Multi-Level-Cell (MLC) operation in Cross-Point OTS-PCM
- Nanbo Gong
- W. Chien
- et al.
- 2020
- VLSI Technology 2020
3D cross-point phase-change memory for storage-class memory
- Huai-Yu Cheng
- Fabio Carta
- et al.
- 2019
- Journal of Physics D: Applied Physics
Comprehensive Scaling Study on 3D Cross-Point PCM toward 1Znm Node for SCM Applications
- W. Chien
- H. Ho
- et al.
- 2019
- VLSI Technology 2019
Superb endurance and appropriate Vth of PCM pillar cell using buffer layer for 3D cross-point memory
- N. Gang
- W. Chien
- et al.
- 2019
- IMW 2019
Solution for PCM and OTS intermixing on cross-point phase change memory
- W. Chien
- Lynne Gignac
- et al.
- 2019
- IMW 2019
A study on OTS-PCM pillar cell for 3-d stackable memory
- W. Chien
- C. Yeh
- et al.
- 2018
- IEEE T-ED
High endurance self-heating OTS-PCM pillar cell for 3D stackable memory
- C. Yeh
- W. Chien
- et al.
- 2018
- VLSI Technology 2018
An ultra high endurance and thermally stable selector based on TeAsGeSiSe chalcogenides compatible with BEOL IC Integration for cross-point PCM
- Huai-Yu Cheng
- W. Chien
- et al.
- 2017
- IEDM 2017
Reliability study of a 128Mb phase change memory chip implemented with doped Ga-Sb-Ge with extraordinary thermal stability
- W. Chien
- Huai-Yu Cheng
- et al.
- 2016
- IEDM 2016