Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
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13 results for Thomas-Michael Winkel
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Framework for co-simulation of signal and power integrity in server systems
- Thomas-Michael Winkel
- Hubert Harrer
- et al.
- 2012
- EPEPS 2012
Methods for calculation of eye diagrams for digital links with multiple aggressors having unknown time offsets
- Dion Timmermann
- Renato Rimolo-Donadio
- et al.
- 2012
- SPI 2012
Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
- A. Deutsch
- Roger Krabbenhoft
- et al.
- 2008
- SPI 2008
Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
Superior electrical properties of High Performance Glass Ceramic packaging for demanding SiGe, ASIC, microprocessor and advanced server applications
- Warren D. Dyckman
- Benjamin Fasano
- et al.
- 2005
- DPC 2005
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- A. Deutsch
- T.-M. Winkel
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003