Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
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92 results for Alina Deutsch
The effects of time windowing on the accuracy of the short-pulse propagation technique
- Lionelle F. Wells
- Alina Deutsch
- et al.
- 2009
- EPEPS 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Prediction of high-performance on-chip global interconnection
- Yulei Zhang
- Xiang Hu
- et al.
- 2009
- SLIP 2009
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009
Interconnect performance and scaling strategy for the 22 nm node and beyond
- James H.-C. Chen
- Lijun Jiang
- et al.
- 2008
- ADMETA 2008
Design methodology of high performance on-chip global interconnect using terminated transmission-line
- Yulei Zhang
- Ling Zhang
- et al.
- 2009
- ISQED 2009
An analysis on measurement sensitivity of short-pulse propagation technique using a virtual test bench
- Zhen Zhou
- Alina Deutsch
- et al.
- 2008
- EPEPS 2008
On-chip bus signaling using passive compensation
- Yulei Zhang
- Ling Zhang
- et al.
- 2008
- EPEPS 2008
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008