Film crystallographic texture and substrate surface roughness in layered aluminum metallization
- K.P. Rodbell
- V. Svilan
- et al.
- 1996
- MRS Spring Meeting 1996
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126 results for Ken Rodbell
Dependence of crystallographic texture of C54 TiSi2 on thickness and linewidth in submicron CMOS structures
- V. Svilan
- K.P. Rodbell
- et al.
- 1996
- MRS Spring Meeting 1996
Manufacturability versus reliability issues relevant to interconnect metallizations
- K.P. Rodbell
- E.G. Colgan
- et al.
- 1994
- MRS Spring Meeting 1994
Quasiparticle tunneling as a probe of Josephson junction barrier and capacitor material in superconducting qubits
- C. Kurter
- Conal E. Murray
- et al.
- 2022
- npj Quantum Information
Ultra low contact resistivities for CMOS beyond 10-nm node
- Zhen Zhang
- Siyuranga Obasa Koswatta
- et al.
- 2013
- IEEE Electron Device Letters
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
- Adam Pyzyna
- Hsinyu Tsai
- et al.
- 2017
- IITC 2017
Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
SOI FinFET soft error upset susceptibility and analysis
- Phil Oldiges
- Ken Rodbell
- et al.
- 2015
- IRPS 2015
The resilience wall: Cross-layer solution strategies
- Subhasish Mitra
- Pradip Bose
- et al.
- 2014
- VLSI-TSA 2014