Michiel Sprik
Journal of Physics Condensed Matter
To meet the European Union Restriction of Hazardous Substances requirements and the continuing demand for lower costs, finer pitch, and high-reliability flip-chip packaging structures, considerable work is going on in the electronic industry to develop lead-free solutions for flip-chip technology. In this paper various solder-bumping technologies developed for flip-chip applications are reviewed with an emphasis on a new wafer-bumping technology called C NP (Controlled-Collapse-Chip-Connect New Process). Several inherent advantages of C NP technology are discussed over other technologies. This paper will also discuss the recent development and implementation of lead-free C interconnections for 300 mm wafers demonstrated at IBM. In addition, some metallurgical considerations associated with C NP technology are discussed.
Michiel Sprik
Journal of Physics Condensed Matter
T.N. Morgan
Semiconductor Science and Technology
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials