A CAD methodology for the characterization of wide on-chip buses
- I.M. Elfadel
- A. Deutsch
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
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64 results for Barry J. Rubin
Accuracy of dielectric constant measurement using the full-sheet-resonance technique IPC-TM-650 2.5.5.6
- A. Deutsch
- A. Huber
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
Electrical modeling of high-speed source synchronous communication
- Barry J. Rubin
- D.N. De Araujo
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
AQUAIA: A CAD tool for on-chip interconnect modeling, analysis, and optimization
- I.M. Elfadel
- M.B. Anand
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
Understanding modeling and measurements of differential transmission lines
- Barry J. Rubin
- 2001
- IEEE Topical Meeting EPEPS 2001
Detailed electrical analysis of a benchmark MCM structure
- Barry J. Rubin
- W.D. Becker
- 2000
- IEEE Topical Meeting EPEPS 2000
Canonical package problem solved using six different codes
- Barry J. Rubin
- 1998
- IEEE Topical Meeting EPEPS 1998
Importance of inductance and inductive coupling for on-chip wiring
- A. Deutsch
- H. Smith
- et al.
- 1997
- IEEE Topical Meeting EPEPS 1997
Design guidelines for short, medium, and long on-chip interconnections
- A. Deutsch
- W.D. Becker
- et al.
- 1996
- IEEE Topical Meeting EPEPS 1996
Comparison of mesh and solid planes for use in electrical packaging
- Barry J. Rubin
- 1996
- IEEE Topical Meeting EPEPS 1996