Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
Publications
Date
Featured collections
Popular topics
20 results for Alexander Janta-Polczynski
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2016
- ECTC 2016
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2016
- OFC 2016
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- GFP 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides
- Tymon Barwicz
- Alexander Janta-Polczynski
- et al.
- 2015
- OFC 2015
Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015