Spectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Publications
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15 results for Aron Cepler
TSV Stress Evolution Mapping using in-line Raman Spectroscopy
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Vertical Travelling Scatterometry for Metrology on Fully Integrated Devices
- D. Schmidt
- Manasa Medikonda
- et al.
- 2022
- SPIE Advanced Lithography 2022
Scatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022
Advanced EUV Resist Characterization using Scatterometry and Machine Learning
- Daniel Schmidt
- Karen Petrillo
- et al.
- 2021
- ASMC 2021
OCD enhanced: Implementation and validation of spectral interferometry for nanosheet inner spacer indentation
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
In-line Raman spectroscopy for stacked nanosheet device manufacturing
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
Development of SiGe Indentation Process Control to Enable Stacked Nanosheet FET Technology
- Dexin Kong
- Daniel Schmidt
- et al.
- 2020
- ASMC 2020
Measuring Local CD Uniformity in EUV vias with scatterometry and machine learning
- Dexin Kong
- Daniel Schmidt
- et al.
- 2020
- SPIE Advanced Lithography 2020
Advanced in-line optical metrology of sub-10nm structures for gate all around devices (GAA)
- R. Muthinti
- Nicolas Loubet
- et al.
- 2016
- SPIE Advanced Lithography 2016