Brian Vanderpool, Phillip Restle, et al.
ISSCC 2022
Methodologies for characterization of the lateral indentation of silicon-germanium (SiGe) nanosheets using different non-destructive and in-line compatible metrology techniques are presented and discussed. Gate-all-around nanosheet device structures with a total of three sacrificial SiGe sheets were fabricated and different etch process conditions used to induce indent depth variations. Scatterometry with spectral interferometry and x-ray fluorescence in conjunction with advanced interpretation and machine learning algorithms were used to quantify the SiGe indentation. Solutions for two approaches, average indent (represented by a single parameter) as well as sheet-specific indent, are presented. Both scatterometry with spectral interferometry as well as x-ray fluorescence measurements are suitable techniques to quantify the average indent through a single parameter. Furthermore, machine learning algorithms enable a fast solution path by combining x-ray fluorescence difference data with scatterometry spectra, therefore avoiding the need for a full optical model solution. A similar machine learning model approach can be employed for sheet-specific indent monitoring; however, reference data from cross-section transmission electron microscopy image analyses are required for training. It was found that scatterometry with spectral interferometry spectra and a traditional optical model in combination with advanced algorithms can achieve a very good match to sheet-specific reference data.
Brian Vanderpool, Phillip Restle, et al.
ISSCC 2022
Frank R. Libsch, S.W. Bedell, et al.
IMAPS 2020
G. Hu, C. Safranski, et al.
IEDM 2022
Milnes David, Pranay Nagrani, et al.
ITherm 2024