Publications

248 results for AI Hardware

Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- - Prabudhya Roy Chowdhury
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- - Hussein Hamieh
  - Juliano Borges
  - et al.
- 2023
- ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023
Acceleration of Decision-Tree Ensemble Models on the IBM Telum Processor
- - Nikolaos Papandreou
  - Jan Van Lunteren
  - et al.
- 2023
- ISCAS 2023
Architectures and Circuits for Analog-memory-based Hardware Accelerators for Deep Neural Networks
- - Sidney Tsai
  - Pritish Narayanan
  - et al.
- 2023
- ISCAS 2023