D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applicationsKatsuyuki SakumaRoy Yuet al.2024IEDM 2024
Challenges in the implementation of artificial intelligence hardware based on phase change devicesGuy CohenAmlan Majumdaret al.2024MRS Fall Meeting 2024
Energy-Efficient Phase-Change Memory Disc-Type Cells Leveraging Ultrathin Phase-Change FilmsTimothy PhilipGhazi Sarwat Syedet al.2024MRS Fall Meeting 2024
Complex Optimization Problem Solving with Low Variability Neuromorphic VO2-Based OscillatorsOlivier MaherValeria Bragagliaet al.2024MRS Fall Meeting 2024
Analog Conductive-Metal-Oxide/HfOx ReRAM Devices - BEOL Integration, Characterization and ModellingDonato Francesco FalconeValeria Bragagliaet al.2024MRS Fall Meeting 2024
RETRO-LI: Small-Scale Retrieval Augmented Generation Supporting Noisy Similarity Searches and Domain Shift GeneralizationGentiana RashitiKumudu Geethan Karunaratneet al.2024ECAI 2024
Demonstration of 4-quadrant analog in-memory matrix multiplication in a single modulationManuel Le GalloOscar Hrynkevychet al.2024npj Unconv. Comput.
Advancements in Memristor Device Development: From Material Stack Optimization to Physical ModellingValeria BragagliaDonato Francesco Falconeet al.2024B-MRS 2024
Resource As You Wish: Collaborative Reservation and Allocation by Scheduler Plugin and Device PluginTakuya MishinaTatsuhiro Chiba2024KubeDay Japan 2024