Lithographic qualification of high-Transmission mask blank for 10nm node and beyond
- Yongan Xu
- Tom Faure
- et al.
- 2016
- SPIE Advanced Lithography 2016
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19 results at SPIE Advanced Lithography 2016
Ultimate 2D resolution printing with negative tone development
- Martin Burkhardt
- Yongan Xu
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
Evaluation of ALE processes for patterning
- J. M. Papalia
- Nathan Marchack
- et al.
- 2016
- SPIE Advanced Lithography 2016
Modeling and parameter tuning for templated directed self-Assembly
- Balint Meliorisz
- T. Mülders
- et al.
- 2016
- SPIE Advanced Lithography 2016
Strategies to enable directed self-Assembly contact hole shrink for tight pitches
- Kristin Schmidt
- Hitoshi Osaki
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
Plasma etch patterning of EUV lithography: Balancing roughness and selectivity trade off
- Sebastian U. Engelmann
- Qinghuang Lin
- et al.
- 2016
- SPIE Advanced Lithography 2016
Through-pellicle defect inspection of EUV masks using an ArF-based inspection tool
- Dario Goldfarb
- William Broadbent
- et al.
- 2016
- SPIE Advanced Lithography 2016
Thermomechanical behavior of EUV pellicle under dynamic exposure conditions
- Dario Goldfarb
- Max O. Bloomfield
- et al.
- 2016
- SPIE Advanced Lithography 2016