C.E. Murray, H. Yan, et al.
Journal of Applied Physics
Thickness data from semiconductor-grade silicon-on-insulator thin-film samples determined from high-resolution X-ray diffraction (HRXRD) data using the Scherrer equation, rocking-curve modeling, thickness fringe analysis, Fourier analysis and the Warren-Averbach method, as well as with cross-sectional transmission electron microscopy and X-ray reflectivity measurements, are presented. The results show that the absolute accuracy of thin-film thickness values obtained from HRXRD data is approximately 1 nm for all techniques if all sources of broadening are correctly identified, while their precision is one or two orders of magnitude smaller. The use of multiple techniques is required to determine the various contributions to peak broadening. © 2009 International Union of Crystallography.
C.E. Murray, H. Yan, et al.
Journal of Applied Physics
Conal E. Murray, Robert Rosenberg, et al.
Journal of Applied Physics
N.R. Bonda, I.C. Noyan
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
S.M. Rossnagel, I.C. Noyan, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures