Conference paper
Extendibility of PVD barrier/seed for BEOL Cu metallization
C.-C. Yang, D. Edelstein, et al.
IITC 2005
Modification of low-k dielectric materials during photoresist plasma stripping was examined using a variety of analytical techniques. These techniques were initially applied to blanket wafers and were subsequently applied to both specially-designed test structures and product structures on patterned wafers. Results of these experiments are presented and analyzed.
C.-C. Yang, D. Edelstein, et al.
IITC 2005
D. Edelstein, H.S. Rathore, et al.
IRPS 2004
H. Kawasaki, V.S. Basker, et al.
IEDM 2009
M.A. Worsley, S. Bent, et al.
Journal of Applied Physics