Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing
- Victor Chan
- A. Gasasira
- et al.
- 2023
- IEEE Trans Semicond Manuf
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Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement
- Daniel Schmidt
- Aron Cepler
- et al.
- 2022
- IEEE Trans Semicond Manuf
Yield learning methodologies and failure isolation in ring oscillator circuit for CMOS technology research
- Victor Chan
- Kangguo Cheng
- et al.
- 2019
- IEEE Trans Semicond Manuf
Study of TiN and TaN underlayer properties and their influence on W growth
- Shanti Pancharatnam
- Gabriel Rodriguez
- et al.
- 2019
- IEEE Trans Semicond Manuf
Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
- Luciana Meli
- Ravi Bonam
- et al.
- 2017
- IEEE Trans Semicond Manuf
Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line Copper Dual-Damascene Structures
- Joyeeta Nag
- S. Ray
- et al.
- 2015
- IEEE Trans Semicond Manuf
E-beam hot spot inspection for early detection of systematic patterning problems for a 22 nm SOI technology
- Oliver D. Patterson
- Deborah A. Ryan
- et al.
- 2014
- IEEE Trans Semicond Manuf
A unified framework for outlier detection in trace data analysis
- Zhiguo Li
- Robert J. Baseman
- et al.
- 2014
- IEEE Trans Semicond Manuf
Novel 4 GHz interleaved SRAM cells with asymmetrical precharge in 45 nm PDSOI technology
- Rajiv V. Joshi
- Rouwaida Kanj
- et al.
- 2014
- IEEE Trans Semicond Manuf
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf