Fabrication and characterization of InGaAs-on-insulator lateral N+/n/N+ structures

Lateral N+/n/N+ InGaAs-on-insulator structures are successfully fabricated by direct wafer bonding and selective regrowth. Electrical characterizations are performed for varying n-layer thickness from fully-depleted films up to the limit of partial depletion. Measurements under externally applied uniaxial tensile strain show an improved drive current.