G. Almasi, G. Almasi, et al.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
In this paper the effect of metal roughness on the total loss, the extracted tanδ, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown. © 2005 IEEE.
G. Almasi, G. Almasi, et al.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
A. Deutsch, W.D. Becker, et al.
IEEE Topical Meeting EPEPS 1996
A. Deutsch, G. Arjavalingam, et al.
ECTC 1994
I.M. Elfadel, A. Deutsch, et al.
DATE 2004