Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
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36 results for Christopher W. Surovic
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections
- A. Deutsch
- H. Harrer
- et al.
- 1998
- IEDM 1998
When are transmission-line effects important for on-chip interconnections
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1997
- ECTC 1997
Intra-system interconnects for digital communications
- A. Deutsch
- G. Arjavalingam
- et al.
- 1994
- ECTC 1994
Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
- A. Deutsch
- Roger Krabbenhoft
- et al.
- 2008
- SPI 2008
Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
Losses caused by roughness of metallization in printed-circuit boards
- A. Deutsch
- C. Surovic
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Superior electrical properties of High Performance Glass Ceramic packaging for demanding SiGe, ASIC, microprocessor and advanced server applications
- Warren D. Dyckman
- Benjamin Fasano
- et al.
- 2005
- DPC 2005