Extremely thin SOI (ETSOI) technology: Past, present, and future
Kangguo Cheng, A. Khakifirooz, et al.
IEEE International SOI Conference 2010
We report high-performance extremely thin SOI MOSFETs fabricated with a channel thickness down to 3.5 nm, sub-20-nm gate length, and contacted gate pitch of 100 nm. At an effective channel length of 18 nm, a drain-induced barrier lowering of 100 mV is achieved by either thinning the channel to 3.5 nm or by applying a reverse back-gate bias to 6-nm channel MOSFETs. Moreover, minimal increase in series resistance is seen when the channel is scaled to 3.5 nm, resulting in no performance degradation with SOI thickness scaling. © 2011 IEEE.
Kangguo Cheng, A. Khakifirooz, et al.
IEEE International SOI Conference 2010
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IEEE Electron Device Letters
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S3S 2014
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ECS Transactions