Automated SEM Offset using programmed defects
- Oliver D. Patterson
- Andrew Stamper
- et al.
- 2011
- ASMC 2011
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12 results for Andrew Stamper
Line edge roughness and spacing effect on low-k TDDB characteristics
- F. Chen
- J.R. Lloyd
- et al.
- 2008
- IRPS 2008
Electromigration reliability of advanced interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- International Workshop on Stress-Induced Phenomena in Metallization 2007
Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
Extendibility of PVD barrier/seed for BEOL Cu metallization
- C.-C. Yang
- D. Edelstein
- et al.
- 2005
- IITC 2005
Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003
Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Film properties and integration of a composite PECVD FSG film
- R. Wistrom
- G. Bomberger
- et al.
- 2002
- IITC 2002
Bimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998