Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
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31 results for Mark D. Schultz
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
High Performance Compliant Heat Sinks
- Mark D. Schultz
- 2022
- ITherm 2022
Microprocessor Performance with Multiple Cooling Approaches
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2022
- ITherm 2022
A single flexible coldplate cools multiple devices
- Shurong Tian
- Todd Takken
- et al.
- 2019
- ITherm 2019
Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)
- Daniel M. Kuchta
- Jonathan E. Proesel
- et al.
- 2019
- OFC 2019
Sim2Cool: A Two-Phase Cooling System Simulator and Design Tool
- Pritish R. Parida
- Mark D. Schultz
- et al.
- 2018
- ITherm 2018