New High-Resolution and High-Sensitivity Deep UV, X-Ray, and Electron-Beam Resists
- M. Hatzakis
- K.J. Stewart
- et al.
- 1991
- JES
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38 results for M. Hatzakis
Silylation of resist materials using di- and polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1990
- Microelectronic Engineering
New high resolution and high sensitivity deep UV, x-ray, and electron beam resists
- Michael Hatzakis
- Kevin J. Stewart
- et al.
- 1990
- Microelectronic Engineering
A simple bilayer lift-off process
- David F. Witman
- Jane M. Shaw
- et al.
- 1990
- Microelectronic Engineering
Chemistry of hexamethylcyclotrisilazane (HMCTS) silylation
- K.J. Stewart
- J.M. Shaw
- et al.
- 1989
- Symposium on Patterning Science and Technology 1989
Chemical and physical aspects of multilayer resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1989
- Proceedings of SPIE 1989
A comparison of the E-beam sensitivities and relative O2-plasma stabilities of organosilicon polymers.Part III. Lithographic characteristics of poly-1,1,3-trimethyl-1-sila - and poly-1,1,3,3-tetramethyl-1,3- disilacyclobutenes and related silmethylene polymers
- E. Babich
- J. Paraszczak
- et al.
- 1989
- Microelectronic Engineering
Epoxy resins for deep UV lithography
- K.J. Stewart
- M. Hatzakis
- et al.
- 1988
- SPE Regional Technical Conference 1988
The use of organosilicon polymers in multilayer plasma resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1987
- Microelectronic Engineering
A comparison of the E-beam and UV-sensitivities and relative O2- plasma stabilities of organosilicon polymers.Part II. Lithographic characteristics of polysilphenylene siloxanes and some organic polymers with pendant silyl groups
- E. Babich
- J.M. Shaw
- et al.
- 1987
- Microelectronic Engineering