Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
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84 results for Lawrence Clevenger
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
Cleans for Al vias in a 0.175 μm Dual Damascene Process
- J.P. Gambino
- L. Clevenger
- et al.
- 1999
- IITC 1999
Silicide formation in Ti-Si and Co-Si reactions
- L. Clevenger
- Q.Z. Hong
- et al.
- 1993
- MRS Proceedings 1993
Role of Stress Relief in the Hexagonai=Close=Packed to Face-Centered-Cubic Phase Transformation in Cobalt Thin Films
- D.A. Smith
- K. Barmak
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Effects of ion implantation on crystallization of amorphous CoSi2
- Q.Z. Hong
- K. Barmak
- et al.
- 1992
- MRS Proceedings 1992
Crystallographic texture of C54 titanium disilicide as a function of deep submicron structure geometry
- V. Svilan
- K.P. Rodbell
- et al.
- 1997
- Journal of Electronic Materials
Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- Nicholas A. Lanzillo
- Lawrence Clevenger
- et al.
- 2020
- Journal of Applied Physics