Physical and electrical properties of scaled gate stacks on Si/passivated In0.53Ga0.47As
- Chiara Marchiori
- Mario El Kazzi
- et al.
- 2013
- ECS Transactions
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33 results at ECS Transactions
Recent developments in ST-MRAM, including scaling
- Eugene J. O'Sullivan
- Martin J. Gajek
- et al.
- 2013
- ECS Transactions
X-ray characterization of PEALD versus PVD tantalum nitride barrier deposition and the impact on via contact resistance
- Xunyuan Zhang
- Oscar Van der Straten
- et al.
- 2013
- ECS Transactions
TiN metal hard mask removal with selectivity to tungsten and TiN liner
- S. Lippy
- L. Chen
- et al.
- 2013
- ECS Transactions
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James J. Kelly
- X. Lin
- et al.
- 2013
- ECS Transactions
In situ growth of Si nanowires using transmission electron microscopy
- Yi-Chia Chou
- Cheng-Yen Wen
- et al.
- 2013
- ECS Transactions
Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement
- Ingrid Shao
- T. Cheng
- et al.
- 2013
- ECS Transactions
New paradigms for cost-effective III-V photovoltaic technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2013
- ECS Transactions
Stress characterization of tungsten-filled through silicon via arrays using very high resolution multi-wavelength raman spectroscopy
- Jeff Gambino
- Daniel Vanslette
- et al.
- 2011
- ECS Transactions
Interactions of metal-organic PEALD TaN with ultra-low k dielectric materials
- O. Van Der Straten
- H. Shobha
- et al.
- 2010
- ECS Transactions