Conference paperUltra-thin Body and BOX (UTBB) device for aggressive scaling of CMOS technologyQ. Liu, A. Yagishita, et al.CSTIC 2011
Conference paperDevice design considerations for next generation CMOS technology: Planar FDSOI and FinFET (Invited)Bruce Doris, Kangguo Cheng, et al.VLSI-TSA 2013
Conference paperUltra-thin-body and BOX (UTBB) Fully Depleted (FD) device integration for 22nm node and beyondQ. Liu, A. Yagishita, et al.VLSI Technology 2010
Conference paperThermal stability of ultra-thin InGaAs-on-insulator substratesN. Daix, Lukas Czornomaz, et al.S3S 2013