Interconnects exhibiting enhanced electromigration short-length effects by line width variation
- Ronald Filippi
- P.-C. Wang
- et al.
- 2014
- IRPS 2014
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26 results for P.-C. Wang
Thermal stress control in Cu interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IITC/AMC 2014
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2013
- Microelectronic Engineering
CVD Co capping layers for Cu/low-k interconnects: Cu em enhancement vs. Co thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2011
- IITC/MAM 2011
Characterization of copper electromigration dependence on selective chemical vapor deposited cobalt capping layer thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2011
- IEEE Electron Device Letters
Stress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters
Characterization of "ultrathin-Cu"/Ru(Ta)/TaN liner stack for copper interconnects
- C.-C. Yang
- S. Cohen
- et al.
- 2010
- IEEE Electron Device Letters
Characterization of selectively deposited cobalt capping layers: Selectivity and electromigration resistance
- C.-C. Yang
- P. Flaitz
- et al.
- 2010
- IEEE Electron Device Letters
Selective chemical vapor deposition-grown Ru for Cu interconnect capping applications
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2010
- Electrochemical and Solid-State Letters
The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
- R. Filippi
- P.-C. Wang
- et al.
- 2009
- IRPS 2009