Design, preparation, characterization, and lithographic imaging of high performance chemically amplified deep UV resist

Resist systems are engineered to satisfy a variety of stringent requirements. Functional polymers used as resist resins play a major role in determining the resist properties and lithographic performance. This article describes the design concept, preparation, and material and lithographic characterizations of Shipley's UVIIHS and UVIII resists, which have been built by the IBM/Shipley deep UV (248 nm) resist alliance on the IBM's ESCAP resist platform.